特許英語例文集

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LEAVING STH (PP/ADJ/PHRASE/to-V)

$$ Thus the application can simply request a link to another terminal, and direct data to it, leaving the communications subsystem to worry about the actual transmission. / 従って、アプリケーションは単に別の端末に対するリンクを要求してそれにデータを指向させ、実際の伝送についての配慮は通信サブシステムに任せることができる。(USP5454079)

$$ These 2352 bytes encode audio data but computer data has another layer of error correction on top, leaving 2048 bytes of user data. / これらの２３５２バイトはオーディオデータを符号化するが、コンピュータデータは他の誤り訂正をその上に有し、ユーザデータは２０４８バイトとなる。(USP6560176)

$$ The PTFE layer 5 readily separates from the set silver layer 22, leaving the upper end region of each body coated in a solid silver layer. / ＰＴＦＥ層５は、該セットされた銀層２２から容易に分離し、固体銀層に被覆された各体の上端範囲を残す。(USP6699767)

$$ In a significant number of real examples, there is a requirement to subtly alter a small range of colors, leaving all other colors alone. (USP6072499)

$$ As a result, the ACR's control will adapt up to an admission rate at which it does not restrict traffic, and will eventually deallocate, leaving the DACS in control of call admission. / したがってＡＣＲの制御により、それがトラヒックを制限しない認可レートに適合し、その結果ＤＡＣＳは呼の認可を制御したまま割当てをする。(USP6330313)

$$ Alternatively, light loads may be arranged by using less detonating cord, leaving the gaps between some adjacent projections empty. (USP6584908)

$$ The identification of duplicates gives a user who is waiting for a response to a message the flexibility to retry sending the message, leaving the system to ensure that there is no confusion between the first message and the retry. (USP6138168)

$$ To achieve this a crystal selector is provided in the mould to annihilate most of the columnar grains generated from the furnace chill plate, leaving only one grain to penetrate into the mould cavity. (USP02005265)

$$ By compiling only fragments of code rather than whole methods, it is made possible only to compile the most desirable sections of code, leaving the less desirable fragments uncompiled. (USP02029357)

$$ The wax is then removed from the hardened slurry mould, for example by steam autoclaving, leaving a mould cavity of the desired structure.(USP02005265)

$$ The upper station 32 is then lifted and the mould parts 41 and 42 are separated, leaving a preform or parison 60 of the kind shown in FIG. 6 on the base assembly 31, with an integral, moulded dust cap. (USP02005202)

$$ Then the GaAs layer 105 is removed, leaving the structure illustrated by FIG. 19c.(USP01022495)

$$ After the attachment of the AlGaInP LED chip 61 to heat sink 62 as shown in FIG. 9, the GaAs substrate 5 of chip 61 is selectively etched off, leaving the lower surface of the AlGaInP LED core 8 exposed.(USP01022495)

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